Friday, October 20, 2017

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SMT Assembly - Components are mounted by placing them directly onto the PCB's surface. We have the capabilities to assemble SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or double-sided component insertions. Our production facilities can assemble the following SMT Types:

 • Ball Grid Array (BGA)
 • Ultra-Fine Ball Grid Array (uBGA)
 • Quad Flat Pack No-Lead (QFN)
 • Quad Flat Package (QFP)
 • Small Outline Integrated Circuit (SOIC)
 • Plastic Leaded Chip Carrier (PLCC)
 • Package-On-Package (PoP)
 • Small Chip Packages (pitch of 0.2 mm)